libtss2-dev binary package in openKylin Huanghe V3.0 i386

 TPM2.0 TSS (Software Stack) consists of API layers provided to support
 TPM 2.0 chips. It is made out of three layers:
 .
   - Enhanced System API (ESAPI)
   - System API (SAPI), which implements the system layer API;
   - Marshaling/Unmarshaling (MU)
   - TPM Command Transmission Interface (TCTI), which is used by SAPI to
     allow communication with the TAB/RM layer;
 .
 This package contains development files for use when writing applications
 that need access to TPM chips.

Publishing history

Date Status Target Pocket Component Section Priority Phased updates Version
  2024-10-15 03:20:27 UTC Published openKylin Huanghe V3.0 i386 release main libdevel Optional 4.0.1-ok1
  • Published
  • Copied from openkylin nile-proposed i386 in Primary Archive for openKylin
  2024-10-15 03:20:27 UTC Published openKylin Huanghe V3.0 i386 proposed main libdevel Optional 4.0.1-ok1
  • Published
  • Copied from openkylin nile-proposed i386 in Primary Archive for openKylin